TIM (Thermal Interface Material)
핵심기술
- Solvent free 저점도
- High filling 가능 : Max 90wt%
- 분산 및 Filler 응집현상이 없음
Silicone
- 함량 : 90wt% 충진을 위한 형상, 크기, 조합
- BLT(Bond Line Thickness) 결정
Filler
- 고열전도도, Thin BLT → 열저항 ↓
- High filling 가능 : Max 90wt%
- 분산 및 Filler 응집현상이 없음
High grade TIM
Silicone
Solvent free
저점도
응집방지
Filler
형상, 함량
크기
조합
TIM
Higher 열전도도
Thin BLT
Bleeding out 최소화
Air gap 최소화
Filler 응집 無
Rth vs. BLT plot
MT-S75-100
Active measurements
| BLT [um] | Rth [K/W] | Rth [K/Wcm2] | Average pressure [kPa] |
|---|---|---|---|
| 111 | 1.37 | 1.77 | 1 |
| 151 | 1.61 | 2.07 | -1 |
| 192 | 1.84 | 2.37 | 0 |
| 231 | 2.06 | 2.64 | -1 |
Regression
K = 1.37 W/(mK)Regression equation : 0.7486 + 0.0057 x
R2 = 1.000
O2k = ±0.015 W/(mK)
O2Rth = ±0.006 K/W
MT-A88-32
Active measurements
| BLT [um] | Rth [K/W] | Rth [K/Wcm2] | Average pressure [kPa] |
|---|---|---|---|
| 31 | 0.69 | 0.89 | 1 |
| 71 | 0.81 | 1.05 | -1 |
| 111 | 0.96 | 1.24 | 0 |
| 151 | 1.12 | 1.44 | 1 |
| 192 | 1.26 | 1.62 | 0 |
| 231 | 1.40 | 1.80 | 0 |
Regression
K = 2.15 W/(mK)
R2 = 0.999
O2k = ±0.032 W/(mK)
O2Rth = ±0.009 K/W
MT-A88-32
Active measurements
| BLT [um] | Rth [K/W] | Rth [K/Wcm2] | Average pressure [kPa] |
|---|---|---|---|
| 72 | 0.79 | 1.01 | 0 |
| 111 | 0.90 | 1.15 | 2 |
| 151 | 1.01 | 1.30 | 0 |
| 191 | 1.13 | 1.45 | 0 |
| 231 | 1.24 | 1.59 | 0 |
Regression
K = 2.72 W/(mK)
R2 = 1.000
O2k = ±0.019 W/(mK)
O2Rth = ±0.003 K/W